PI-Silicone Composite Films are engineered as a high-performance thermally conductive silicone-polyimide laminate, reinforced with a specialized PTFE-coated silicone surface. This advanced composite provides a reliable solution for critical heat dissipation and electrical insulation in high-density electronics. Whether for power modules or semiconductor assemblies, our films ensure long-term dimensional stability and superior dielectric protection under demanding thermal conditions.
Core Features & Benefits
- Advanced Thermal Management: With a thermal conductivity of ≥0.95 W/m·K, these films efficiently bridge the gap between heat sources and heat sinks.
- Superior Dielectric Strength: The polyimide (PI) core provides robust electrical insulation, preventing short circuits in compact semiconductor modules.
- Exceptional Flexibility: Engineered for versatility, the laminate conforms easily to irregular surfaces without cracking or losing performance.
- PTFE Surface Coating: The specialized PTFE layer offers chemical resistance and easy release properties, enhancing processing efficiency during assembly.
- Dimensional Stability: Maintains precise thickness and shape even under fluctuating temperatures, ensuring consistent performance.
| Style | Description | PI Thickness (μm/mil) | Silicone Thickness (μm/mil) | PTFE Thickness (μm/mil) | Thermal Conductivity (W/m·K) |
|---|---|---|---|---|---|
| PS25-125 | PI one side SI and PTFE | 25 (1) | 125 (6) | 3 (0.12) | ≥ 0.95 |
| PS25-80 | PI both sides SI and PTFE | 25 (1) | 80 (3) | 3 (0.12) | ≥ 0.95 |
Industry Applications
- Electronics Manufacturing: Ideal for thermal interface pads and insulating layers in consumer electronics.
- Semiconductor Modules: Used in high-power semiconductor packaging to manage heat dissipation.
- Power Supplies: Enhances reliability in transformers and automotive power systems.
- Aerospace & Defense: Provides critical insulation in high-temperature environments.
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